產(chǎn)品關(guān)鍵詞：
WAFER-LX3,嵌入式主板,威達工控主板,威達嵌入式主板,板載AMD,
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Wafer-LX3
3.5" SBC, AMD Geode™ LX800 Processor with VGA/LVDS/TTL,Dual LAN, USB 2.0, Audio and On-Board Memory
| Features |
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1. 3.5" Form Factor with AMD Geode™ LX800 (500MHz) CPU
2. On-board DDR 256MB memory
3. VGA, 24-bit TTL, 18-bit LVDS Display Interface
4. 1 x RS-232 and 1 x RS-232/422/485
5. Supports wide operating temperature |
| Specifications |
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| CPU |
AMD Geode™ LX800 (500MHz) processor |
| System Chipset |
AMD Geode CS5536 I/O companion |
| BIOS |
Award BIOS |
| System Memory |
DDR 256MB on-board, optional 128MB |
| Ethernet |
Dual 10/100 Mbps Intel® 82551ER controller |
| I/O Interface |
1 x RS-232
1 x RS-232/422/485
4 x USB 2.0
1 x IDE
1 x LPT |
| Super I/O |
Winbond W83627EHG |
| Digital I/O |
8-bit digital I/O, 4-bit input/ 4-bit output |
| Infrared |
N/A |
| Audio |
AC`97 codec with Realtek ALC203 |
| SSD |
CF type I/II |
| Display Interfaces |
VGA Integrated in AMD Geode™ LX800
24-bit TTL
18-bit single channel LVDS |
| Expansion |
PC/104 (ISA Bus) |
| Watchdog Timer |
Software programmable supports 1 ~255 sec. System reset |
| Power Supply |
AT/ATX support |
| Power Consumption |
5V@1.34A (AMD Geode LX800 (500MHz) CPU with 256MB on-board memory) |
| Temperature |
operation:
0°C ~+60°C for WAFER-LX3-800
-20°C ~+80°C for WAFER-LX3-800W |
| Humidity |
operation: 5% ~95%non-condensing |
| Dimensions |
146 mm x 102 mm |
| Weight |
GW: 600g; NW: 160g |
產(chǎn)品關(guān)鍵詞：
WAFER-LX3,嵌入式主板,威達工控主板,威達嵌入式主板,板載AMD,
![WAFER-LX3—威達電 3.5寸嵌入式主板]()
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