PCB P/N:104_DCP_R2
Layer Count:4L
Material:FR-4 TG130
Board thk:1.6mm
copper thk:1/1/1/1oz
Smallest hole size:0.3MM
No. of holes (pcs):295
line w/s:12/8mil
Impedance control. Y / N (Tol %):N
Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen:Green
Single board size:Dim X (mm):80;Dim Y (mm):116
Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
Special:peelable mask:N
Routing/Punching:CNC
